
The company said it could have memory-on-processor technology by 2009 for use in servers, supercomputers and other machines.
IBM has discovered a way to connect chips inside products ranging from cell phones to supercomputers. This assures prolong battery life in wireless devices and speedy data transfers between the processor and memory chips in computers.
Through this manufacturing technique, the long metal wires used to transfer information between chips no more exists. As a part of the technique, two chips are sandwiched on top of one another and the distance between them is measured in microns or millionths of a meter, held together by vertical connections that are etched in silicon holes that are filled with metal.
Known as “through-silicon-vias,”, the vertical connections allow multiple chips to be stacked together with greater information flow between them. Company’s three-dimensional approach creates the possibility of up to 100 times more pathways for information, and shortens by 1,000 times the distance that information on a chip needs to travel.
“This is a big step, this is a really historic move,” said David Lammers, director of WeSRCH.com, a social networking Web site for semiconductor enthusiasts and part of VLSI Research Inc. “This has been studied to death, but it’s the first time a company is saying, ‘We can connect two chips in the vertical direction.”
“We are continuing to innovate _ now we have a new degree of freedom to get more functionality out of chips,” said Lisa Su, vice president for semiconductor R & D at IBM.
IBM